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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Soldering reactions under space confinement for 3D IC applications
Details
Soldering reactions under space confinement for 3D IC applications
Journal
Electronic Components and Technology Conference
Pages
724-728
ISBN
9781467319669
Date Issued
2012
Author(s)
Kao C.R.
Chuang H.Y.
Chen W.M.
Yang T.L.
Kuo M.S.
Chen Y.J.
Yu J.J.
C. ROBERT KAO
DOI
10.1109/ECTC.2012.6248912
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84866865839&doi=10.1109%2fECTC.2012.6248912&partnerID=40&md5=66441cc947896f5e0edad920394ad203
https://scholars.lib.ntu.edu.tw/handle/123456789/432635
SDGs
[SDGs]SDG11
Type
conference paper
