Critical concerns in soldering reactions arising from space confinement in 3-D IC packages

Journal

IEEE Transactions on Device and Materials Reliability

Journal Volume

12

Journal Issue

2

Pages

233-240

Date Issued

2012

Author(s)

Chuang H.Y.

Yang T.L.

Kuo M.S.

Chen Y.J.

Yu J.J.

Li C.C.

DOI

10.1109/TDMR.2012.2185239

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84862026416&doi=10.1109%2fTDMR.2012.2185239&partnerID=40&md5=6f3c9b5894888c1f5fdbc13451f0fe2e

https://scholars.lib.ntu.edu.tw/handle/123456789/432636

Type

journal article