https://scholars.lib.ntu.edu.tw/handle/123456789/432636| Title: | Critical concerns in soldering reactions arising from space confinement in 3-D IC packages | Authors: | Chuang H.Y. Yang T.L. Kuo M.S. Chen Y.J. Yu J.J. Li C.C. Kao C.R. C. ROBERT KAO |
Issue Date: | 2012 | Journal Volume: | 12 | Journal Issue: | 2 | Start page/Pages: | 233-240 | Source: | IEEE Transactions on Device and Materials Reliability | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84862026416&doi=10.1109%2fTDMR.2012.2185239&partnerID=40&md5=6f3c9b5894888c1f5fdbc13451f0fe2e https://scholars.lib.ntu.edu.tw/handle/123456789/432636 |
ISSN: | 15304388 | DOI: | 10.1109/TDMR.2012.2185239 |
| Appears in Collections: | 材料科學與工程學系 |
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