https://scholars.lib.ntu.edu.tw/handle/123456789/432649| Title: | Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing | Authors: | Ke J.H. Yang T.L. Lai Y.S. C. ROBERT KAO |
Issue Date: | 2011 | Journal Volume: | 59 | Journal Issue: | 6 | Start page/Pages: | 2462-2468 | Source: | Acta Materialia | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-79951674215&doi=10.1016%2fj.actamat.2010.12.048&partnerID=40&md5=88d1d0e287b8a384f12835a69511b2d3 https://scholars.lib.ntu.edu.tw/handle/123456789/432649 |
ISSN: | 13596454 | DOI: | 10.1016/j.actamat.2010.12.048 |
| Appears in Collections: | 材料科學與工程學系 |
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