https://scholars.lib.ntu.edu.tw/handle/123456789/432652| Title: | Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume | Authors: | Chang C.C. Kao C.R. C. ROBERT KAO |
Issue Date: | 2010 | Source: | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-79951642363&doi=10.1109%2fIMPACT.2010.5699505&partnerID=40&md5=88762a6ef7471872ea490d42be4cec4a https://scholars.lib.ntu.edu.tw/handle/123456789/432652 |
ISBN: | 9781424497836 | DOI: | 10.1109/IMPACT.2010.5699505 |
| Appears in Collections: | 材料科學與工程學系 |
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