Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume
Journal
International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference
ISBN
9781424497836
Date Issued
2010
Author(s)
Chang C.C.
Abstract
The Ni/95Pb5Sn/Cu ternary diffusion couples were used to investigate the cross-interaction between Ni and Cu across a layer of 95Pb5Sn solder. High-lead solder layers with thickness of 100 or 400 μm was electroplated over Cu foils. A pure Ni layer (20 μm) was then deposited over the as-deposited high-lead solder surface. The diffusion couples were then aged at 150 to 250°C for different periods of time. With this technique, the diffusion couples were assembled without experiencing any high temperature process, such as reflow, which would have accelerated the interaction and caused difficulties in analysis. This study revealed that the massive spalling also occurred during aging even though reflow was not used. The massive spalling began with the formation of micro-voids. When the micro-voids congregated into large enough voids, the intermetallics compounds (Cu 3 Sn) started to spall from the interface. This spalling phenomenon occurred sooner with increasing temperature and decreasing solder volume.
Type
conference paper