Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids

Journal

IMPACT Conference 2009 International 3D IC Conference

Pages

64-67

ISBN

9781424443413

Date Issued

2009

Author(s)

Wang Y.W.

DOI

10.1109/IMPACT.2009.5382310

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950786772&doi=10.1109%2fIMPACT.2009.5382310&partnerID=40&md5=48c5d3a6636108a7963fb945c7ba8f3c

https://scholars.lib.ntu.edu.tw/handle/123456789/432670

Type

conference paper