https://scholars.lib.ntu.edu.tw/handle/123456789/432670| Title: | Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids | Authors: | Wang Y.W. Kao C.R. C. ROBERT KAO |
Issue Date: | 2009 | Start page/Pages: | 64-67 | Source: | IMPACT Conference 2009 International 3D IC Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950786772&doi=10.1109%2fIMPACT.2009.5382310&partnerID=40&md5=48c5d3a6636108a7963fb945c7ba8f3c https://scholars.lib.ntu.edu.tw/handle/123456789/432670 |
ISBN: | 9781424443413 | DOI: | 10.1109/IMPACT.2009.5382310 |
| Appears in Collections: | 材料科學與工程學系 |
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