Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

Journal

Journal of Materials Research

Journal Volume

24

Journal Issue

11

Pages

3407-3411

Date Issued

2009

Author(s)

Tsai M.H.

Lin Y.W.

Chuang H.Y.

DOI

10.1557/jmr.2009.0398

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-70450123720&doi=10.1557%2fjmr.2009.0398&partnerID=40&md5=eee7a73c9b17ed0381f14e890bdc07a3

https://scholars.lib.ntu.edu.tw/handle/123456789/432675

Type

journal article