Effect of multiple reflow cycles on ball impact responses of SnAgCu solder joints
Journal
Soldering & Surface Mount Technology
Journal Volume
21
Journal Issue
3
Pages
4-9
Date Issued
2009
Author(s)
Abstract
Purpose The purpose of this paper is to report the effect of multiple reflow cycles on ball impact test (BIT) responses and fractographies obtained at an impact velocity of 500 mm/s on Sn‐4Ag‐0.5Cu solder joints. Design/methodology/approach Solder balls were mounted on copper substrate pads with immersion tin surface finish, supplied by two vendors. For these particular test vehicles and test conditions, fracture near the interface between the interfacial Cu 6 Sn 5 intermetallic compound (IMC) and copper pad was identified as the only failure mode induced by BIT. Findings Measurement results indicate that BIT characteristics in general degrade as the number of reflow cycles increases. Furthermore, scanning electron microscopy observations show that the thickness and grain size of interfacial Cu 6 Sn 5 increase with increasing number of reflow cycles. This correlation confirms the familiar notion that a thicker Cu 6 Sn 5 degrades the interfacial strength. Originality/value There are few reports that can attribute failure directly to the IMC(s) at the interface. This paper, however, successfully correlates the weakening solder joints with the thickening and shape changes of IMC(s) in a direct way.
Type
journal article