Effect of multiple reflow cycles on ball impact responses of SnAgCu solder joints

Journal

Soldering & Surface Mount Technology

Journal Volume

21

Journal Issue

3

Pages

4-9

Date Issued

2009

Author(s)

Lai Y.

Chang H.

Kao C.

DOI

10.1108/09540910910970358

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-68249085881&doi=10.1108%2f09540910910970358&partnerID=40&md5=3aae624f43d7dafe3d9b03813e6f3c80

https://scholars.lib.ntu.edu.tw/handle/123456789/432677

Type

journal article