https://scholars.lib.ntu.edu.tw/handle/123456789/432681| Title: | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Authors: | Wang Y.W. Lin Y.W. Kao C.R. C. ROBERT KAO |
Issue Date: | 2009 | Journal Volume: | 49 | Journal Issue: | 3 | Start page/Pages: | 248-252 | Source: | Microelectronics Reliability | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-60849105954&doi=10.1016%2fj.microrel.2008.09.010&partnerID=40&md5=76e83b2b2e19aae327dfd9a6eb4730d3 https://scholars.lib.ntu.edu.tw/handle/123456789/432681 |
ISSN: | 00262714 | DOI: | 10.1016/j.microrel.2008.09.010 |
| Appears in Collections: | 材料科學與工程學系 |
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