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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
Details
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
Journal
Microelectronics Reliability
Journal Volume
49
Journal Issue
3
Pages
248-252
Date Issued
2009
Author(s)
Wang Y.W.
Lin Y.W.
C. ROBERT KAO
DOI
10.1016/j.microrel.2008.09.010
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-60849105954&doi=10.1016%2fj.microrel.2008.09.010&partnerID=40&md5=76e83b2b2e19aae327dfd9a6eb4730d3
https://scholars.lib.ntu.edu.tw/handle/123456789/432681
Type
journal article