Interfacial reaction and wetting behavior between Pt and molten solder

Journal

Journal of Electronic Materials

Journal Volume

38

Journal Issue

1

Pages

25-32

Date Issued

2009

Author(s)

Yang S.C.

Chang W.C.

Wang Y.W.

DOI

10.1007/s11664-008-0541-1

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-57649228423&doi=10.1007%2fs11664-008-0541-1&partnerID=40&md5=0730e4dd42548c78e13eee36a5fe34c5

https://scholars.lib.ntu.edu.tw/handle/123456789/432682

Type

journal article