https://scholars.lib.ntu.edu.tw/handle/123456789/432683| Title: | Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth | Authors: | Wang Y.W. Kao C.R. C. ROBERT KAO |
Issue Date: | 2008 | Start page/Pages: | 76-79 | Source: | 2008 10th International Conference on Electronic Materials and Packaging | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049094473&doi=10.1109%2fEMAP.2008.4784233&partnerID=40&md5=fad4cf6e5f67d91553766ecd85eee63a https://scholars.lib.ntu.edu.tw/handle/123456789/432683 |
ISBN: | 9781424436217 | DOI: | 10.1109/EMAP.2008.4784233 |
| Appears in Collections: | 材料科學與工程學系 |
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