Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth

Journal

2008 10th International Conference on Electronic Materials and Packaging

Pages

76-79

ISBN

9781424436217

Date Issued

2008

Author(s)

Wang Y.W.

DOI

10.1109/EMAP.2008.4784233

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049094473&doi=10.1109%2fEMAP.2008.4784233&partnerID=40&md5=fad4cf6e5f67d91553766ecd85eee63a

https://scholars.lib.ntu.edu.tw/handle/123456789/432683

Type

conference paper