https://scholars.lib.ntu.edu.tw/handle/123456789/432684| Title: | Microstructure study of high lead bump FCBGA bending test | Authors: | Hung L.Y. Chang P.H. Chang C.C. Wang Y.P. Hsiao C.S. Kao C.R. C. ROBERT KAO |
Issue Date: | 2008 | Start page/Pages: | 255-258 | Source: | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049107879&doi=10.1109%2fIMPACT.2008.4783859&partnerID=40&md5=f30e464f692e419a1301ea9771ef0454 https://scholars.lib.ntu.edu.tw/handle/123456789/432684 |
ISBN: | 9781424436248 | DOI: | 10.1109/IMPACT.2008.4783859 |
| Appears in Collections: | 材料科學與工程學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.