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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Microstructure study of high lead bump FCBGA bending test
Details
Microstructure study of high lead bump FCBGA bending test
Journal
2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference
Pages
255-258
ISBN
9781424436248
Date Issued
2008
Author(s)
Hung L.Y.
Chang P.H.
Chang C.C.
Wang Y.P.
Hsiao C.S.
C. ROBERT KAO
DOI
10.1109/IMPACT.2008.4783859
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049107879&doi=10.1109%2fIMPACT.2008.4783859&partnerID=40&md5=f30e464f692e419a1301ea9771ef0454
https://scholars.lib.ntu.edu.tw/handle/123456789/432684
Type
conference paper
