Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cu

Journal

Journal of Electronic Materials

Journal Volume

37

Journal Issue

10

Pages

1591-1597

Date Issued

2008

Author(s)

Yang S.C.

Wang Y.W.

CHIEN-CHENG CHANG

DOI

10.1007/s11664-008-0521-5

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-51849128171&doi=10.1007%2fs11664-008-0521-5&partnerID=40&md5=e2b37aee7c56b32ecc383cd0878675d0

https://scholars.lib.ntu.edu.tw/handle/123456789/432686

Type

journal article