https://scholars.lib.ntu.edu.tw/handle/123456789/432687| Title: | Pronounced electromigration of Cu in molten Sn-based solders | Authors: | Huang J.R. Tsai C.M. Lin Y.W. Kao C.R. C. ROBERT KAO |
Issue Date: | 2008 | Journal Volume: | 23 | Journal Issue: | 1 | Start page/Pages: | 250-257 | Source: | Journal of Materials Research | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-38649137985&doi=10.1557%2fjmr.2008.0024&partnerID=40&md5=d6bcefeaafb4ddcad0620333f1b25e78 https://scholars.lib.ntu.edu.tw/handle/123456789/432687 |
ISSN: | 08842914 | DOI: | 10.1557/jmr.2008.0024 |
| Appears in Collections: | 材料科學與工程學系 |
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