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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Pronounced electromigration of Cu in molten Sn-based solders
Details
Pronounced electromigration of Cu in molten Sn-based solders
Journal
Journal of Materials Research
Journal Volume
23
Journal Issue
1
Pages
250-257
Date Issued
2008
Author(s)
Huang J.R.
Tsai C.M.
Lin Y.W.
C. ROBERT KAO
DOI
10.1557/jmr.2008.0024
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-38649137985&doi=10.1557%2fjmr.2008.0024&partnerID=40&md5=d6bcefeaafb4ddcad0620333f1b25e78
https://scholars.lib.ntu.edu.tw/handle/123456789/432687
Type
journal article