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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration
Details
Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration
Journal
Journal of Electronic Materials
Journal Volume
37
Journal Issue
1
Pages
96-101
Date Issued
2008
Author(s)
Lin Y.L.
Lai Y.S.
Lin Y.W.
C. ROBERT KAO
DOI
10.1007/s11664-007-0293-3
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-37249038598&doi=10.1007%2fs11664-007-0293-3&partnerID=40&md5=d93c7be613ae33d55adf49ca1208fb7d
https://scholars.lib.ntu.edu.tw/handle/123456789/432688
Type
journal article