https://scholars.lib.ntu.edu.tw/handle/123456789/432688| Title: | Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration | Authors: | Lin Y.L. Lai Y.S. Lin Y.W. Kao C.R. C. ROBERT KAO |
Issue Date: | 2008 | Journal Volume: | 37 | Journal Issue: | 1 | Start page/Pages: | 96-101 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-37249038598&doi=10.1007%2fs11664-007-0293-3&partnerID=40&md5=d93c7be613ae33d55adf49ca1208fb7d https://scholars.lib.ntu.edu.tw/handle/123456789/432688 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-007-0293-3 |
| Appears in Collections: | 材料科學與工程學系 |
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