Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration

Journal

Journal of Electronic Materials

Journal Volume

37

Journal Issue

1

Pages

96-101

Date Issued

2008

Author(s)

Lin Y.L.

Lai Y.S.

Lin Y.W.

DOI

10.1007/s11664-007-0293-3

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-37249038598&doi=10.1007%2fs11664-007-0293-3&partnerID=40&md5=d93c7be613ae33d55adf49ca1208fb7d

https://scholars.lib.ntu.edu.tw/handle/123456789/432688

Type

journal article