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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Interfacial reaction issues for lead-free electronic solders
Details
Interfacial reaction issues for lead-free electronic solders
Journal
Journal of Materials Science: Materials in Electronics
Journal Volume
18
Journal Issue
1-3
Pages
155-174
Date Issued
2007
Author(s)
Ho C.E.
Yang S.C.
C. ROBERT KAO
DOI
10.1007/s10854-006-9031-5
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-33845692077&doi=10.1007%2fs10854-006-9031-5&partnerID=40&md5=3d11d9480d49fc853328e3321d25ff6c
https://scholars.lib.ntu.edu.tw/handle/123456789/432699
Type
journal article