Interfacial reaction issues for lead-free electronic solders

Journal

Journal of Materials Science: Materials in Electronics

Journal Volume

18

Journal Issue

1-3

Pages

155-174

Date Issued

2007

Author(s)

Ho C.E.

Yang S.C.

DOI

10.1007/s10854-006-9031-5

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33845692077&doi=10.1007%2fs10854-006-9031-5&partnerID=40&md5=3d11d9480d49fc853328e3321d25ff6c

https://scholars.lib.ntu.edu.tw/handle/123456789/432699

Type

journal article