https://scholars.lib.ntu.edu.tw/handle/123456789/432700
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin Y.L. | en_US |
dc.contributor.author | Lai Y.S. | en_US |
dc.contributor.author | Tsai C.M. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Tsai C.M.;Lai Y.S.;Lin Y.L. | - |
dc.date.accessioned | 2019-11-27T02:02:57Z | - |
dc.date.available | 2019-11-27T02:02:57Z | - |
dc.date.issued | 2006 | - |
dc.identifier.issn | 03615235 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33846430875&doi=10.1007%2fs11664-006-0325-4&partnerID=40&md5=830dbe8dd33443e75fde1351c2287f8f | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432700 | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1007/s11664-006-0325-4 | - |
dc.identifier.scopus | 2-s2.0-33846430875 | - |
dc.relation.pages | 2147-2153 | - |
dc.relation.journalvolume | 35 | - |
dc.relation.journalissue | 12 | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。