https://scholars.lib.ntu.edu.tw/handle/123456789/432700
Title: | Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration | Authors: | Lin Y.L. Lai Y.S. Tsai C.M. C. ROBERT KAO |
Issue Date: | 2006 | Journal Volume: | 35 | Journal Issue: | 12 | Start page/Pages: | 2147-2153 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33846430875&doi=10.1007%2fs11664-006-0325-4&partnerID=40&md5=830dbe8dd33443e75fde1351c2287f8f https://scholars.lib.ntu.edu.tw/handle/123456789/432700 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-006-0325-4 |
Appears in Collections: | 材料科學與工程學系 |
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