Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

5

Pages

1010-1016

Date Issued

2006

Author(s)

Lin Y.L.

Chang C.W.

Tsai C.M.

Lee C.W.

DOI

10.1007/BF02692561

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745085927&doi=10.1007%2fBF02692561&partnerID=40&md5=8c30ca433e087ec1a14487e0b77dd1eb

https://scholars.lib.ntu.edu.tw/handle/123456789/432705

Type

conference paper