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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints
Details
Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints
Journal
Journal of Electronic Materials
Journal Volume
35
Journal Issue
5
Pages
1010-1016
Date Issued
2006
Author(s)
Lin Y.L.
Chang C.W.
Tsai C.M.
Lee C.W.
C. ROBERT KAO
DOI
10.1007/BF02692561
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745085927&doi=10.1007%2fBF02692561&partnerID=40&md5=8c30ca433e087ec1a14487e0b77dd1eb
https://scholars.lib.ntu.edu.tw/handle/123456789/432705
Type
conference paper