https://scholars.lib.ntu.edu.tw/handle/123456789/432705| Title: | Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints | Authors: | Lin Y.L. Chang C.W. Tsai C.M. Lee C.W. Kao C.R. C. ROBERT KAO |
Issue Date: | 2006 | Journal Volume: | 35 | Journal Issue: | 5 | Start page/Pages: | 1010-1016 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745085927&doi=10.1007%2fBF02692561&partnerID=40&md5=8c30ca433e087ec1a14487e0b77dd1eb https://scholars.lib.ntu.edu.tw/handle/123456789/432705 |
ISSN: | 03615235 | DOI: | 10.1007/BF02692561 |
| Appears in Collections: | 材料科學與工程學系 |
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