Effects of limited Cu supply on soldering reactions between SnAgCu and Ni

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

5

Pages

1017-1024

Date Issued

2006

Author(s)

Ho C.E.

Lin Y.W.

Yang S.C.

Kao C.R.

DOI

10.1007/BF02692562

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745040036&doi=10.1007%2fBF02692562&partnerID=40&md5=a49bfa146dadd507cfb7ee4f8b0bf062

https://scholars.lib.ntu.edu.tw/handle/123456789/432707

Type

conference paper