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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Effects of limited Cu supply on soldering reactions between SnAgCu and Ni
Details
Effects of limited Cu supply on soldering reactions between SnAgCu and Ni
Journal
Journal of Electronic Materials
Journal Volume
35
Journal Issue
5
Pages
1017-1024
Date Issued
2006
Author(s)
Ho C.E.
Lin Y.W.
Yang S.C.
Kao C.R.
C. ROBERT KAO
DOI
10.1007/BF02692562
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745040036&doi=10.1007%2fBF02692562&partnerID=40&md5=a49bfa146dadd507cfb7ee4f8b0bf062
https://scholars.lib.ntu.edu.tw/handle/123456789/432707
Type
conference paper