https://scholars.lib.ntu.edu.tw/handle/123456789/432707| Title: | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Authors: | Ho C.E. Lin Y.W. Yang S.C. Kao C.R. Jiang D.S. C. ROBERT KAO |
Issue Date: | 2006 | Journal Volume: | 35 | Journal Issue: | 5 | Start page/Pages: | 1017-1024 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745040036&doi=10.1007%2fBF02692562&partnerID=40&md5=a49bfa146dadd507cfb7ee4f8b0bf062 https://scholars.lib.ntu.edu.tw/handle/123456789/432707 |
ISSN: | 03615235 | DOI: | 10.1007/BF02692562 |
| Appears in Collections: | 材料科學與工程學系 |
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