Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

2

Pages

366-371

Date Issued

2006

Author(s)

Chang C.W.

Lee Q.P.

Ho C.E.

DOI

10.1007/BF02692458

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33644891049&doi=10.1007%2fBF02692458&partnerID=40&md5=ef0578de1e08dde3139049888a2376cb

https://scholars.lib.ntu.edu.tw/handle/123456789/432708

Publisher

Minerals, Metals and Materials Society

Type

conference paper