Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations

Journal

Materials Science and Engineering A

Journal Volume

396

Journal Issue

1-2

Pages

385-391

Date Issued

2005

Author(s)

Luo W.C.

Ho C.E.

Tsai J.Y.

Lin Y.L.

DOI

10.1016/j.msea.2005.02.008

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-15944408791&doi=10.1016%2fj.msea.2005.02.008&partnerID=40&md5=0a96cdb299980fa8ef1068d19ecd7801

https://scholars.lib.ntu.edu.tw/handle/123456789/432715

Type

journal article