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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
Details
In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
Journal
Acta Materialia
Journal Volume
53
Journal Issue
7
Pages
2029-2035
Date Issued
2005
Author(s)
Lin Y.H.
Hu Y.C.
Tsai C.M.
Kao C.R.
Tu K.N.
C. ROBERT KAO
DOI
10.1016/j.actamat.2005.01.014
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-14544277886&doi=10.1016%2fj.actamat.2005.01.014&partnerID=40&md5=4860c33baacfca6f74d9e6c5f6bb98d2
https://scholars.lib.ntu.edu.tw/handle/123456789/432716
SDGs
[SDGs]SDG14
Type
journal article