https://scholars.lib.ntu.edu.tw/handle/123456789/432716
Title: | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Authors: | Lin Y.H. Hu Y.C. Tsai C.M. Kao C.R. Tu K.N. C. ROBERT KAO |
Issue Date: | 2005 | Journal Volume: | 53 | Journal Issue: | 7 | Start page/Pages: | 2029-2035 | Source: | Acta Materialia | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-14544277886&doi=10.1016%2fj.actamat.2005.01.014&partnerID=40&md5=4860c33baacfca6f74d9e6c5f6bb98d2 https://scholars.lib.ntu.edu.tw/handle/123456789/432716 |
ISSN: | 13596454 | DOI: | 10.1016/j.actamat.2005.01.014 |
Appears in Collections: | 材料科學與工程學系 |
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