Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction

Journal

Applied Physics Letters

Journal Volume

85

Journal Issue

13

Pages

2490-2492

Date Issued

2004

Author(s)

Wu A.T.

Tu K.N.

Lloyd J.R.

Tamura N.

Valek B.C.

DOI

10.1063/1.1795353

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-7544234470&doi=10.1063%2f1.1795353&partnerID=40&md5=b1ad8bd64585b781cebbf177efb90fb8

https://scholars.lib.ntu.edu.tw/handle/123456789/432719

Type

journal article