Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints

Journal

Journal of Electronic Materials

Journal Volume

33

Journal Issue

10

Pages

1092-1097

Date Issued

2004

Author(s)

Lin Y.L.

Luo W.C.

Lin Y.H.

Ho C.E.

DOI

10.1007/s11664-004-0109-7

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-7044223296&doi=10.1007%2fs11664-004-0109-7&partnerID=40&md5=4600ca4f4c252c1a716a42ef72511822

https://scholars.lib.ntu.edu.tw/handle/123456789/432720

Publisher

Minerals, Metals and Materials Society

Type

journal article