https://scholars.lib.ntu.edu.tw/handle/123456789/432722| Title: | Chemical reaction in solder joints of microelectronic packages | Authors: | Ho C.E. Lin Y.L. Tsai J.Y. Kao C.R. C. ROBERT KAO |
Issue Date: | 2003 | Journal Volume: | 34 | Journal Issue: | 4 | Start page/Pages: | 387-391 | Source: | Journal of the Chinese Institute of Chemical Engineers | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0141989557&partnerID=40&md5=66a1dbc57d0e9a75e7f1752046f84aa5 https://scholars.lib.ntu.edu.tw/handle/123456789/432722 |
ISSN: | 03681653 |
| Appears in Collections: | 材料科學與工程學系 |
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