Chemical reaction in solder joints of microelectronic packages

Journal

Journal of the Chinese Institute of Chemical Engineers

Journal Volume

34

Journal Issue

4

Pages

387-391

Date Issued

2003

Author(s)

Ho C.E.

Lin Y.L.

Tsai J.Y.

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0141989557&partnerID=40&md5=66a1dbc57d0e9a75e7f1752046f84aa5

https://scholars.lib.ntu.edu.tw/handle/123456789/432722

Type

journal article