A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni

Journal

Journal of Electronic Materials

Journal Volume

32

Journal Issue

11

Pages

1203-1208

Date Issued

2003

Author(s)

Tsai J.Y.

Hu Y.C.

Tsai C.M.

DOI

10.1007/s11664-003-0012-7

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0348107255&doi=10.1007%2fs11664-003-0012-7&partnerID=40&md5=ece7a47b56cd391c0236caee258562a2

https://scholars.lib.ntu.edu.tw/handle/123456789/432724

Publisher

Minerals, Metals and Materials Society

Type

journal article