https://scholars.lib.ntu.edu.tw/handle/123456789/432724| Title: | A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni | Authors: | Tsai J.Y. Hu Y.C. Tsai C.M. Kao C.R. C. ROBERT KAO |
Issue Date: | 2003 | Publisher: | Minerals, Metals and Materials Society | Journal Volume: | 32 | Journal Issue: | 11 | Start page/Pages: | 1203-1208 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0348107255&doi=10.1007%2fs11664-003-0012-7&partnerID=40&md5=ece7a47b56cd391c0236caee258562a2 https://scholars.lib.ntu.edu.tw/handle/123456789/432724 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-003-0012-7 |
| Appears in Collections: | 材料科學與工程學系 |
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