Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Journal

Journal of Materials Research

Journal Volume

18

Journal Issue

11

Pages

2544-2548

Date Issued

2003

Author(s)

Hu Y.C.

Lin Y.H.

Kao C.R.

Tu K.N.

DOI

10.1557/JMR.2003.0355

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0242468675&doi=10.1557%2fJMR.2003.0355&partnerID=40&md5=6ba9e3cce97817e27828bbe1eef72c16

https://scholars.lib.ntu.edu.tw/handle/123456789/432725

Publisher

Materials Research Society

Type

journal article