https://scholars.lib.ntu.edu.tw/handle/123456789/432725| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hu Y.C. | en-US |
| dc.contributor.author | Lin Y.H. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | Tu K.N. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Tu K.N.;Kao C.R.;Lin Y.H.;Hu Y.C. | - |
| dc.date.accessioned | 2019-11-27T02:03:05Z | - |
| dc.date.available | 2019-11-27T02:03:05Z | - |
| dc.date.issued | 2003 | - |
| dc.identifier.issn | 08842914 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0242468675&doi=10.1557%2fJMR.2003.0355&partnerID=40&md5=6ba9e3cce97817e27828bbe1eef72c16 | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432725 | - |
| dc.publisher | Materials Research Society | - |
| dc.relation.ispartof | Journal of Materials Research | - |
| dc.title | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | en_US |
| dc.type | journal article | - |
| dc.identifier.doi | 10.1557/JMR.2003.0355 | - |
| dc.identifier.scopus | 2-s2.0-0242468675 | - |
| dc.relation.pages | 2544-2548 | - |
| dc.relation.journalvolume | 18 | - |
| dc.relation.journalissue | 11 | - |
| item.cerifentitytype | Publications | - |
| item.fulltext | no fulltext | - |
| item.grantfulltext | none | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
| item.openairetype | journal article | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
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