https://scholars.lib.ntu.edu.tw/handle/123456789/432727| Title: | Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Authors: | Shiau L.C. Ho C.E. Kao C.R. C. ROBERT KAO |
Issue Date: | 2002 | Journal Volume: | 14 | Journal Issue: | 3 | Start page/Pages: | 25-29+6+8 | Source: | Soldering and Surface Mount Technology | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-18644381608&doi=10.1108%2f09540910210444692&partnerID=40&md5=dd7e6e794a399ca5990cb790c95b17b2 https://scholars.lib.ntu.edu.tw/handle/123456789/432727 |
ISSN: | 09540911 | DOI: | 10.1108/09540910210444692 |
| Appears in Collections: | 材料科學與工程學系 |
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