Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

Journal

Soldering and Surface Mount Technology

Journal Volume

14

Journal Issue

3

Pages

25-29+6+8

Date Issued

2002

Author(s)

Shiau L.C.

Ho C.E.

DOI

10.1108/09540910210444692

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-18644381608&doi=10.1108%2f09540910210444692&partnerID=40&md5=dd7e6e794a399ca5990cb790c95b17b2

https://scholars.lib.ntu.edu.tw/handle/123456789/432727

Type

conference paper