https://scholars.lib.ntu.edu.tw/handle/123456789/432728| Title: | Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni | Authors: | Ho C.E. Lin Y.L. Kao C.R. C. ROBERT KAO |
Issue Date: | 2002 | Journal Volume: | 14 | Journal Issue: | 3 | Start page/Pages: | 949-951 | Source: | Chemistry of Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036209651&doi=10.1021%2fcm010639h&partnerID=40&md5=db76184a7b0af93106581342c6d200ec https://scholars.lib.ntu.edu.tw/handle/123456789/432728 |
ISSN: | 08974756 | DOI: | 10.1021/cm010639h |
| Appears in Collections: | 材料科學與工程學系 |
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