Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni
Journal
Chemistry of Materials
Journal Volume
14
Journal Issue
3
Pages
949-951
Date Issued
2002
Author(s)
Abstract
A slight change in the Cu concentration in the Sn-Ag-Cu solders can make a big difference in the strength of a solder joint in microelectronic packages. It was shown that (Ni1-xCux)3Sn4 formed at the interface when Sn-3.9Ag-0.2Cu (wt%) solder was reacted with Ni and (Cu1-yNiy)6Sn5 formed when Sn-3.9Ag-0.6Cu was reacted with Ni. The industry therefore must impose a very strict control over the Cu concentration to produce the desired intermetallic compound.
SDGs
Type
journal article