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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni
Details
Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni
Journal
Chemistry of Materials
Journal Volume
14
Journal Issue
3
Pages
949-951
Date Issued
2002
Author(s)
Ho C.E.
Lin Y.L.
C. ROBERT KAO
DOI
10.1021/cm010639h
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036209651&doi=10.1021%2fcm010639h&partnerID=40&md5=db76184a7b0af93106581342c6d200ec
https://scholars.lib.ntu.edu.tw/handle/123456789/432728
Type
journal article