Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni

Journal

Chemistry of Materials

Journal Volume

14

Journal Issue

3

Pages

949-951

Date Issued

2002

Author(s)

Ho C.E.

Lin Y.L.

DOI

10.1021/cm010639h

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036209651&doi=10.1021%2fcm010639h&partnerID=40&md5=db76184a7b0af93106581342c6d200ec

https://scholars.lib.ntu.edu.tw/handle/123456789/432728

Type

journal article