https://scholars.lib.ntu.edu.tw/handle/123456789/432731| Title: | The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization | Authors: | Tsai J.Y. Kao C.R. C. ROBERT KAO |
Issue Date: | 2002 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Start page/Pages: | 271-275 | Source: | 4th International Symposium on Electronic Materials and Packaging | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966628872&doi=10.1109%2fEMAP.2002.1188849&partnerID=40&md5=d28b7da69d469bb7b3d61e0b44392b84 https://scholars.lib.ntu.edu.tw/handle/123456789/432731 |
ISBN: | 078037682X 9780780376823 |
DOI: | 10.1109/EMAP.2002.1188849 |
| Appears in Collections: | 材料科學與工程學系 |
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