Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints

Journal

Journal of Electronic Materials

Journal Volume

31

Journal Issue

11

Pages

1264-1269

Date Issued

2002

Author(s)

Ho C.E.

Shiau L.C.

DOI

10.1007/s11664-002-0019-5

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036867582&doi=10.1007%2fs11664-002-0019-5&partnerID=40&md5=ac402e58c40e3ad5baf39a33925c3974

https://scholars.lib.ntu.edu.tw/handle/123456789/432734

Publisher

Minerals, Metals and Materials Society

Type

journal article