Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Journal

Journal of Materials Research

Journal Volume

17

Journal Issue

2

Pages

263-266

Date Issued

2002

Author(s)

Chen W.T.

Ho C.E.

DOI

10.1557/JMR.2002.0036

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036477472&doi=10.1557%2fJMR.2002.0036&partnerID=40&md5=453cf5a7387a41759604d39142de2dc0

https://scholars.lib.ntu.edu.tw/handle/123456789/432735

Publisher

Materials Research Society

Type

journal article