https://scholars.lib.ntu.edu.tw/handle/123456789/432735| Title: | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | Authors: | Chen W.T. Ho C.E. Kao C.R. C. ROBERT KAO |
Issue Date: | 2002 | Publisher: | Materials Research Society | Journal Volume: | 17 | Journal Issue: | 2 | Start page/Pages: | 263-266 | Source: | Journal of Materials Research | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036477472&doi=10.1557%2fJMR.2002.0036&partnerID=40&md5=453cf5a7387a41759604d39142de2dc0 https://scholars.lib.ntu.edu.tw/handle/123456789/432735 |
ISSN: | 08842914 | DOI: | 10.1557/JMR.2002.0036 |
| Appears in Collections: | 材料科學與工程學系 |
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