New failure mode induced by electric current in flip chip solder joint

Journal

4th International Symposium on Electronic Materials and Packaging 2002

Pages

253-258

ISBN

078037682X

9780780376823

Date Issued

2002

Author(s)

Lin Y.H.

Hu Y.C.

Tsai J.

DOI

10.1109/EMAP.2002.1188846

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966603300&doi=10.1109%2fEMAP.2002.1188846&partnerID=40&md5=c0a1369b4261d2d53eac4eb07c35ef4e

https://scholars.lib.ntu.edu.tw/handle/123456789/432736

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper