Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Journal

Journal of Electronic Materials

Journal Volume

31

Journal Issue

6

Pages

584-590

Date Issued

2002

Author(s)

Ho C.E.

Tsai R.Y.

Lin Y.L.

DOI

10.1007/s11664-002-0129-0

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036610410&doi=10.1007%2fs11664-002-0129-0&partnerID=40&md5=5125f5ce70e7a2910647adbf4067387e

https://scholars.lib.ntu.edu.tw/handle/123456789/432737

SDGs

[SDGs]SDG6

Publisher

Minerals, Metals and Materials Society

Type

journal article