https://scholars.lib.ntu.edu.tw/handle/123456789/432741
Title: | Interactions between solder and metallization during long-term aging of advanced microelectronic packages | Authors: | Ho C.E. Chen W.T. C. ROBERT KAO |
Issue Date: | 2001 | Publisher: | Minerals, Metals and Materials Society | Journal Volume: | 30 | Journal Issue: | 4 | Start page/Pages: | 379-385 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035305461&doi=10.1007%2fs11664-001-0047-6&partnerID=40&md5=960a3f31005adf4335288b12742228a9 https://scholars.lib.ntu.edu.tw/handle/123456789/432741 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-001-0047-6 |
Appears in Collections: | 材料科學與工程學系 |
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