https://scholars.lib.ntu.edu.tw/handle/123456789/432742| Title: | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Authors: | Liu C.M. Ho C.E. Chen W.T. Kao C.R. C. ROBERT KAO |
Issue Date: | 2001 | Publisher: | Minerals, Metals and Materials Society | Journal Volume: | 30 | Journal Issue: | 9 | Start page/Pages: | 1152-1156 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035454941&doi=10.1007%2fs11664-001-0143-7&partnerID=40&md5=feab93819cb755559cd08883f276d0d4 https://scholars.lib.ntu.edu.tw/handle/123456789/432742 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-001-0143-7 |
| Appears in Collections: | 材料科學與工程學系 |
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