Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish

Journal

Journal of Electronic Materials

Journal Volume

30

Journal Issue

9

Pages

1152-1156

Date Issued

2001

Author(s)

Liu C.M.

Ho C.E.

Chen W.T.

DOI

10.1007/s11664-001-0143-7

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035454941&doi=10.1007%2fs11664-001-0143-7&partnerID=40&md5=feab93819cb755559cd08883f276d0d4

https://scholars.lib.ntu.edu.tw/handle/123456789/432742

Publisher

Minerals, Metals and Materials Society

Type

journal article