Skip to main content
English
中文
Log In
Log in
Have you forgotten your password?
Home
Publication:
Optimizing the wire-bonding parameters for second bonds in ball grid array packages
Loading...
Loading...
Date
2000
Authors
Ho C.E.
C. ROBERT KAO;Kao C.R.;Chen C.;Ho C.E.
Chen C.
C. ROBERT KAO
Journal Title
Journal ISSN
Volume Title
Publisher
Research Projects
Organizational Units
Journal Issue
Abstract
Description
Keywords
Citation
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034266675&doi=10.1080%2f02533839.2000.9670583&partnerID=40&md5=bf03e72b905d2708ea04173074db0aa7
https://scholars.lib.ntu.edu.tw/handle/123456789/432744
Collections
Materials Science and Engineering / 材料科學與工程學系
Full item page