Optimizing the wire-bonding parameters for second bonds in ball grid array packages

Journal

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an

Journal Volume

23

Journal Issue

5

Pages

625-632

Date Issued

2000

Author(s)

Ho C.E.

Chen C.

DOI

URI

Type

journal article