https://scholars.lib.ntu.edu.tw/handle/123456789/432744| Title: | Optimizing the wire-bonding parameters for second bonds in ball grid array packages | Authors: | Ho C.E. Chen C. Kao C.R. C. ROBERT KAO |
Issue Date: | 2000 | Journal Volume: | 23 | Journal Issue: | 5 | Start page/Pages: | 625-632 | Source: | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034266675&doi=10.1080%2f02533839.2000.9670583&partnerID=40&md5=bf03e72b905d2708ea04173074db0aa7 https://scholars.lib.ntu.edu.tw/handle/123456789/432744 |
ISSN: | 02533839 | DOI: | 10.1080/02533839.2000.9670583 |
| Appears in Collections: | 材料科學與工程學系 |
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