Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate

Journal

Journal of Electronic Materials

Journal Volume

29

Journal Issue

10

Pages

1200-1206

Date Issued

2000

Author(s)

Chen C.

Ho C.E.

Lin A.H.

Luo G.L.

DOI

10.1007/s11664-000-0013-8

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034293880&doi=10.1007%2fs11664-000-0013-8&partnerID=40&md5=883ca022aba0b0aba76099c3fe255b94

https://scholars.lib.ntu.edu.tw/handle/123456789/432746

Publisher

Minerals, Metals & Materials Soc (TMS), Warrendale

Type

journal article