Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

Journal

Journal of Electronic Packaging, Transactions of the ASME

Journal Volume

137

Journal Issue

3

Date Issued

2015

Author(s)

Lu H.-L.

DOI

10.1115/1.4030803

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/438585

URL

https://www2.scopus.com/inward/record.uri?eid=2-s2.0-84953860497&doi=10.1115%2f1.4030803&partnerID=40&md5=52828b1103e85b88ba77e5fd280481d2

SDGs

[SDGs]SDG7

Type

journal article