Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Journal

Scientific Reports

Journal Volume

7

Date Issued

2017

Author(s)

Yong, Y.

Nguyen, M.T.

Tsukamoto, H.

Matsubara, M.

Liao, Y.-C.

Yonezawa, T.

DOI

10.1038/srep45150

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/445956

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85016137248&doi=10.1038%2fsrep45150&partnerID=40&md5=e74428e91e3a9ea7f6845d3f1aac2e82

Type

journal article