The mode-III fracture analysis of an inclined crack embedded in thin layer systems by analytical alternating methods
Journal
Journal of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an
Journal Volume
27
Journal Issue
6
Pages
783-798
Date Issued
2004
Author(s)
Chang, C.-Y.
Abstract
Abstract This paper analyzes the mode‐III stress intensity factor of an inclined crack, embedded in a thin layer, bonded to a half plane, subjected to arbitrary distributed anti‐plane loads. Special alternating procedures are presented to evaluate the mode‐ III S.I.F. and the numerical results confirm the validity of the proposed alternating procedure. The solution of a bi‐material problem in an infinite plane with an inclined crack and the analytical solution of a thin layer, without crack, bonded to a half plane, subjected to an anti‐plane point force applied on the boundary are referred to as fundamental solutions. By using these fundamental solutions and alternating procedures, the stress intensity factors of a crack in a thin layer bonded to a half plane are evaluated. The numerical results of some reduced problems are computed and excellent agreements with existing solutions are obtained.
SDGs
Type
journal article