3-D micro surface profilometry employing novel Mirau-based lateral scanning interferometry
Journal
Measurement Science and Technology
Journal Volume
25
Journal Issue
9
Date Issued
2014
Author(s)
Abstract
An innovative 3-D surface imaging methodology for reconstructing micro surface profiles with a long depth measuring range and a nano-scale resolution was developed using the newly developed Mirau-based lateral scanning interferometry (LSI). The current measuring field of view (FOV) of conventional white light interferometers is limited by microscopic views of the existing interferometric objectives, such as those in Michelson, Mirau or Linnik designs. Moreover, the vertical scanning operation required for acquiring volumetric interferometric data is extremely time-consuming and makes white light vertical scanning interferometry (VSI) infeasible for automatic optical inspection (AOI) of micro 3-D structures. To resolve this, a newly developed white light LSI method based on Mirau's optical configuration was developed by controlling the tilting angle of the reference mirror in the Mirau interferometric objective. With the proposed optical configuration, the surface is inspected at a tilting angle with respect to the maximum coherence plane of the interferometric system along its lateral scanning direction when the objective lies perpendicular to the tested surface. In addition, a system calibration method was developed to establish an accurate mathematical mapping model between the object depth and the lateral axis. To evaluate the feasibility of the methodology, a calibrated step height was measured for evaluating the accuracy and repeatability. Some industrial samples, such as photon spacers and other microstructures fabricated by nano-imprinting processes, were measured to verify the actual performance on real components. It was found that the measurement repeatability was controlled less than 60 nm within one standard deviation for a maximum measurable depth of 27.21 µm.
Type
journal article