Erratum: The novel chamber hardware design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique; (AIP Advances (2013) 3:7 (072117))
Journal
AIP Advances
Journal Volume
5
Journal Issue
4
Date Issued
2015
Author(s)
Liao, M.-H.
Type
corrigendum
