https://scholars.lib.ntu.edu.tw/handle/123456789/448102
Title: | Thermal stress aware design for stacking IC with through glass via | Authors: | Chien, J.-H. Yu, H. Lung, C.-L. Chang, H.-C. Tsai, N.-Y. Chou, Y.-F. Chen, P.-H. Chang, S.-C. Kwai, D.-M. PING-HEI CHEN |
Issue Date: | 2012 | Start page/Pages: | 133-136 | Source: | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/448102 | DOI: | 10.1109/IMPACT.2012.6420303 |
Appears in Collections: | 機械工程學系 |
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