CO2-assisted thermal fusion bonding of heterogeneous materials by use of surface nano-pillars
Journal
Microsystem Technologies
Journal Volume
19
Journal Issue
2
Pages
151-157
Date Issued
2013
Author(s)
Abstract
Microchip components may involve different polymeric materials for integrated functions, and the thermal bonding of heterogeneous materials is a challenge. This study is devoted to the bonding of polycarbonate (PC) and polymethacrylate (PMMA) materials. For conventional thermal bonding of PC and PMMA, the temperature must be above 150 °C. CO2 is used as a plasticizer to lower the bonding temperature to 90 °C. CO2 also serves as a pressurizing agent to provide uniform bonding pressure. To further improve the bonding strength, surface nano-pillar structures are fabricated on PC before binding it with PMMA. Because of the nano-pillar structures, the contact areas significantly increased, and the structural inter-lock further increased the strength after bonding thereby yielding a bonding strength of 1.20 MPa.
Type
journal article