https://scholars.lib.ntu.edu.tw/handle/123456789/448193
Title: | Singular uniformity after reflow of varied-shaped flip chip solder bump on single substrate | Authors: | Hsu, H.-J. Huang, J.-T. Chao, P.-S. Wu, C.-S. Shih, S.-H. Yang, S.-Y. SEN-YEU YANG |
Issue Date: | 2006 | Start page/Pages: | - | Source: | 2006 International Conference on Electronic Materials and Packaging | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/448193 | DOI: | 10.1109/EMAP.2006.4430608 |
Appears in Collections: | 機械工程學系 |
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