Thermal model of the wet grinding process
Journal
Journal of Materials Processing Technology
Journal Volume
101
Journal Issue
1
Pages
137-145
Date Issued
2000
Author(s)
Abstract
A thermal model of the wet grinding process is presented. The thermal effect of the grain-workpiece interface and the shear plane between the workpiece and the chip is taken into account. By taking all of the parameters needed in the model from the experimental results, the temperature of the workpiece surface in the grinding zone can be predicted. It is shown that the flow rate of the grinding fluid under general grinding conditions is sufficient to cover the thermal boundary layer of the coolant in the grinding zone. The predicted workpiece surface temperatures have been compared to experimental data for some grinding conditions. Good agreement is obtained except for the creep-feed grinding process, when water-based grinding fluid is used. The differences between the theoretical values and experimental results are attributed to constant thermal properties, and neglect of transverse conduction in the development of the thermal model.
SDGs
Type
journal article