Run-To-Run sensor variation monitoring for process fault diagnosis in semiconductor manufacturing
Journal
Winter Simulation Conference
Pages
2523-2534
Date Issued
2017
Author(s)
Abstract
Tool behavior modeling and diagnosis is a big challenge in modern semiconductor fabrication, in particular, with high product-mix and complicated technology nodes. Tool condition monitoring has been long conducted by implementing the Fault Detection and Classification (FDC) system and analyzing the large amount of real-time sensor data collected during the process. The tool condition hierarchy developed in the previous work proposed that the excursions can be firstly detected by an overall condition indicator and then intuitively traced down to the level of sensor groups. In this paper, a Run-to-Run (R2R) variation monitoring technique is developed in order to correlate the tool excursions with individual sensors, instead of sensor groups, and thus to close the diagnostic gap in the hierarchy. Therefore, the tool condition can be efficiently monitored by one overall indicator and the detected tool faults can be systematically diagnosed at the sensor level.
Type
conference paper